Item
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Condition of test
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Performance of requirement
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Tolerance ≦0.05%
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Tolerance>0.05%
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Temperature
Coefficient of
Resistance
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Where t0=+25℃ or specified room temperature
t = -55℃ or +125℃ ± 3℃
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As Specification Table
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Short-time
Overload
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Apply 2.5 times of rated voltage or maxinum overloading voltage for 5 seconds. Have the specimen stabilized at room temperature for 30 minutes. MeasureΔR/R(%).
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ΔR±0.05%
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ΔR±0.5%
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ΔR±0.5% for high power rating
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Dielectric Withstand Voltage
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By Type
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Insulation Resistance
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1000MΩMin.
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Thermal
Shock
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In sequence, place the specimen in the chamber at -55℃ / 25min., 155℃ / 25 min. as a cycle, The transfer time shall not exceed 5 minutes. After 100 cycles the specimen shall be stabilized at room temperature for one hour minimum and then measure the Δ R/R(%).
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ΔR±0.05%
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ΔR±0.25%
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Load Life
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Place the specimen in the oven at 70±2℃. Apply the rated voltage to the specimen at the 1.5 hours “ON” and 0.5 hour “OFF” cycle. The total time of test is 1000 hours. After the test,have the specimen stabilized at room temperature for one hour minimum and MeasureΔR/R(%).
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ΔR±0.05%
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ΔR±0.2%
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>7kΩ ΔR±0.5%
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ΔR±0.5% for high power rating
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Humidity
(Steady State)
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Place the specimen in the chamber at 40±2℃, 90~95%RH.
Apply the rated voltage to the specimen at the 1.5 hours “ON” and 0.5 hour “OFF” cycle. The total time of test is 1000 hours. After the test,have the specimen stabilized at room temperature for one hour minimum and MeasureΔR/R(%).
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ΔR±0.05%
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ΔR±0.3%
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ΔR±0.5% for high power rating
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Resistance to
Soldering heat
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Immerse the specimen in the solder pot at 260 ± 5℃ for 10 ±1 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. MeasureΔR/R(%).
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ΔR±0.05%
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ΔR±0.2%
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Low Temperature Operation
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Place the specimen in the chamber at -65±2℃ and apply rated
voltage for 45 minutes and 15 minutes off. After the test, have
the specimen stabilized at room temperature for 2 hours
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ΔR±0.05%
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ΔR±0.2%
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ΔR±0.5% for high power rating
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Bending Strength
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ΔR±0.05%
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ΔR±0.2%
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Resistance to
Dry Heat
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Place the specimen in the oven at 155±2℃ for 96 hours After the test,have the specimen stabilized at room temperature for
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ΔR±0.05%
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ΔR±0.2%
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Solderability
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At least 95% coverage
(245±5℃, 3sec)
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