Sole design for adjustable hot air forcible guide (Patent No. 156948 & 135016).

Adopt high volume (250 l/min), low pressure (0.22kg/ cm² ), low temp rework (220℃), completely guarantee BGA chips electricity and excellent soldering quality.

Utilization of silence pressure type air blower permit the regulation of silent ventilator, the air flow can be regulated to 250 l/Min the maximum.

Hot air multi-hole round center support, especially useful for big-size PCB and BGA located in the center of PCB. Avoid hollow soldering and IC-drop situation.

Temperature profile of bottom hot air heater can reach as high as 300℃, critical for big size motherboard. Meanwhile, it can setup with upper heater for synchronized work or independent operation.

Utilization of hot air forcible guide, nozzle will match with PC board while heating. Totally uninfluential to other components.

Built-in itinerary reflow display permit clearly control the reflow condition. With vacuum pump, it can pull out the SMD automatically.

The temperature of hot air is stable and the temperature accurately at ± 0.1℃., select as your wish between ℃ and ℉ equipped three groups of PID value, a reference number can be programmed automatically, also can be memorized and stocked.

High speed feedback system, accurate hot air temperature memory.

RS 232 and computer connection for better management. 

Built-in programmable fuzzy hot air temperature and time control system permit the best obtaining of soldering profile.