| 產品介紹 |
依傳統的LED封裝結構為例，一般是用膠或銀膠將LED晶片黏貼在導線架的反射杯中或SMD基座上，再由金或鋁線焊線機完成LED元件的內外連接正負極後用環氧樹脂epoxy封裝而成。若採用傳統式的LED封裝形式其程序雖然簡單，但其熱阻高達250℃/W～300℃/W。LED將會因為散熱不良而導致晶片溫度迅速上升和環氧樹脂變質，從而造成LED元件的加速老化到失去發光功能，且因為持續的熱量累積所產生的發光效率降低並造成加速LED元件本身增溫，增溫效應形成應力造成結構不良而燒毀。
利用Silicones本身具有優良之物理及化學之特性，本公司發展了一系列光電產業封裝用之矽凝膠, 矽膠, 矽樹脂，可用於晶片LED,印刷電路板的封装(Encapsulation),黏著,絕緣,導熱,防潮及緩衝處理。改善傳統環氧樹脂epoxy封裝的先天限制
Our silicone series for encapsulation field exclusively apply in LED, IC chips, CPU & VLSI to transfer the internal heat to outside region, stain higher temperature, moisture proof and adhesive for better weather resistance.
Our silicone series is suitable for temperature (-50) to 250oC for a long time operation mad still keep their characters. It is the best material for Encapsulation purpose specially compare to the epoxy resin.
一般而言(Generally),
Encapsulating Silicone: Ray-8101, 8102, 8632, 8152, 8677, 8122
Heat Conduction Interface: Ray-8011
Products Specification 產品規格
|
品名 Item
|
組成 Composition
|
粘度 Cps
|
成型硬度 Hardness Shore
|
折射 Refractive Index N/mm2
|
透光率 Light Tramsmissivity 450nm/1mm(%)
|
成型條件 Condition
|
|
| |
| |
|
Ray-8101
|
A:B
|
A:400
|
-
|
1.405
|
85
|
150℃, 30 min
|
|
|
01:01
|
B:600
|
|
|
Ray-8102
|
A:B
|
A:10000
|
12(A)
|
1.411
|
88
|
150℃, 5 min
|
|
|
10:01
|
B:1500
|
|
|
Ray-8122
|
A:B
|
A:10000
|
35(A)
|
1.411
|
50
|
150℃, 10 min
|
|
|
10:01
|
B:1500
|
|
|
Ray-8632
|
A:B
|
A:5000
|
30(A)
|
1.522
|
92
|
150℃, 5 min
|
|
|
10:01
|
B:1500
|
|
|
Ray-8152
|
A:B
|
A:2000
|
60(D)
|
1.413
|
88
|
150℃, 5 min
|
|
|
10:01
|
B:1500
|
|
|
Ray-8677
|
A:B
|
A:5000
|
70(D)
|
1.522
|
92
|
150℃, 5 min
|
|
|
10:01
|
B:1500
|
|
|
Ray-8011
|
one
|
-
|
55(A)
|
-
|
-
|
25℃, 5 hrs
|
|
|
component
|
|
Welcome for customer's own requested specification |
|
| 產品特色 |
依傳統的LED封裝結構為例，一般是用膠或銀膠將LED晶片黏貼在導線架的反射杯中或SMD基座上，再由金或鋁線焊線機完成LED元件的內外連接正負極後用環氧樹脂epoxy封裝而成。若採用傳統式的LED封裝形式其程序雖然簡單，但其熱阻高達250℃/W～300℃/W。LED將會因為散熱不良而導致晶片溫度迅速上升和環氧樹脂變質，從而造成LED元件的加速老化到失去發光功能，且因為持續的熱量累積所產生的發光效率降低並造成加速LED元件本身增溫，增溫效應形成應力造成結構不良而燒毀。
利用Silicones本身具有優良之物理及化學之特性，本公司發展了一系列光電產業封裝用之矽凝膠, 矽膠, 矽樹脂，可用於晶片LED,印刷電路板的封装(Encapsulation),黏著,絕緣,導熱,防潮及緩衝處理。改善傳統環氧樹脂epoxy封裝的先天限制
Our silicone series for encapsulation field exclusively apply in LED, IC chips, CPU & VLSI to transfer the internal heat to outside region, stain higher temperature, moisture proof and adhesive for better weather resistance.
Our silicone series is suitable for temperature (-50) to 250oC for a long time operation mad still keep their characters. It is the best material for Encapsulation purpose specially compare to the epoxy resin.
|
|
| 規格說明 |
Encapsulating Silicone: Ray-8101, 8102, 8632, 8152, 8677, 8122
Heat Conduction Interface: Ray-8011
Products Specification 產品規格
|
品名 Item
|
組成 Composition
|
粘度 Cps
|
成型硬度 Hardness Shore
|
折射 Refractive Index N/mm2
|
透光率 Light Tramsmissivity 450nm/1mm(%)
|
成型條件 Condition
|
|
| |
| |
|
Ray-8101
|
A:B
|
A:400
|
-
|
1.405
|
85
|
150℃, 30 min
|
|
|
01:01
|
B:600
|
|
|
Ray-8102
|
A:B
|
A:10000
|
12(A)
|
1.411
|
88
|
150℃, 5 min
|
|
|
10:01
|
B:1500
|
|
|
Ray-8122
|
A:B
|
A:10000
|
35(A)
|
1.411
|
50
|
150℃, 10 min
|
|
|
10:01
|
B:1500
|
|
|
Ray-8632
|
A:B
|
A:5000
|
30(A)
|
1.522
|
92
|
150℃, 5 min
|
|
|
10:01
|
B:1500
|
|
|
Ray-8152
|
A:B
|
A:2000
|
60(D)
|
1.413
|
88
|
150℃, 5 min
|
|
|
10:01
|
B:1500
|
|
|
Ray-8677
|
A:B
|
A:5000
|
70(D)
|
1.522
|
92
|
150℃, 5 min
|
|
|
10:01
|
B:1500
|
|
|
Ray-8011
|
one
|
-
|
55(A)
|
-
|
-
|
25℃, 5 hrs
|
|
|
component
|
|
Welcome for customer's own requested specification |
|
|
