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Silicone Series for LED,Solar and Electronic Encapsulation |
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| 產品介紹 |
依傳統的LED封裝結構為例，一般是用膠或銀膠將LED晶片黏貼在導線架的反射杯中或SMD基座上，再由金或鋁線焊線機完成LED元件的內外連接正負極後用環氧樹脂epoxy封裝而成。若採用傳統式的LED封裝形式其程序雖然簡單，但其熱阻高達250℃/W～300℃/W。LED將會因為散熱不良而導致晶片溫度迅速上升和環氧樹脂變質，從而造成LED元件的加速老化到失去發光功能，且因為持續的熱量累積所產生的發光效率降低並造成加速LED元件本身增溫，增溫效應形成應力造成結構不良而燒毀。
利用Silicones本身具有優良之物理及化學之特性，本公司發展了一系列光電產業封裝用之矽凝膠, 矽膠, 矽樹脂，可用於晶片LED,印刷電路板的封装(Encapsulation),黏著,絕緣,導熱,防潮及緩衝處理。改善傳統環氧樹脂epoxy封裝的先天限制
Our silicone series for encapsulation field exclusively apply in LED, IC chips, CPU & VLSI to transfer the internal heat to outside region, stain higher temperature, moisture proof and adhesive for better weather resistance.
Our silicone series is suitable for temperature (-50) to 250oC for a long time operation mad still keep their characters. It is the best material for Encapsulation purpose specially compare to the epoxy resin.
一般而言(Generally),
Encapsulating Silicone: Ray-8101, 8102, 8632, 8152, 8677, 8122
Heat Conduction Interface: Ray-8011
Products Specification 產品規格
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品名 Item
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組成 Composition
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粘度 Cps
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成型硬度 Hardness Shore
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折射 Refractive Index N/mm2
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透光率 Light Tramsmissivity 450nm/1mm(%)
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成型條件 Condition
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Ray-8101
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A:B
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A:400
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-
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1.405
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85
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150℃, 30 min
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01:01
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B:600
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Ray-8102
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A:B
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A:10000
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12(A)
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1.411
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88
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150℃, 5 min
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10:01
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B:1500
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Ray-8122
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A:B
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A:10000
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35(A)
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1.411
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50
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150℃, 10 min
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10:01
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B:1500
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Ray-8632
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A:B
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A:5000
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30(A)
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1.522
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92
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150℃, 5 min
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10:01
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B:1500
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Ray-8152
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A:B
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A:2000
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60(D)
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1.413
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88
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150℃, 5 min
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10:01
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B:1500
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Ray-8677
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A:B
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A:5000
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70(D)
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1.522
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92
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150℃, 5 min
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10:01
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B:1500
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Ray-8011
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one
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-
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55(A)
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-
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25℃, 5 hrs
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component
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Welcome for customer's own requested specification |
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| 產品特色 |
依傳統的LED封裝結構為例，一般是用膠或銀膠將LED晶片黏貼在導線架的反射杯中或SMD基座上，再由金或鋁線焊線機完成LED元件的內外連接正負極後用環氧樹脂epoxy封裝而成。若採用傳統式的LED封裝形式其程序雖然簡單，但其熱阻高達250℃/W～300℃/W。LED將會因為散熱不良而導致晶片溫度迅速上升和環氧樹脂變質，從而造成LED元件的加速老化到失去發光功能，且因為持續的熱量累積所產生的發光效率降低並造成加速LED元件本身增溫，增溫效應形成應力造成結構不良而燒毀。
利用Silicones本身具有優良之物理及化學之特性，本公司發展了一系列光電產業封裝用之矽凝膠, 矽膠, 矽樹脂，可用於晶片LED,印刷電路板的封装(Encapsulation),黏著,絕緣,導熱,防潮及緩衝處理。改善傳統環氧樹脂epoxy封裝的先天限制
Our silicone series for encapsulation field exclusively apply in LED, IC chips, CPU & VLSI to transfer the internal heat to outside region, stain higher temperature, moisture proof and adhesive for better weather resistance.
Our silicone series is suitable for temperature (-50) to 250oC for a long time operation mad still keep their characters. It is the best material for Encapsulation purpose specially compare to the epoxy resin.
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| 規格說明 |
Encapsulating Silicone: Ray-8101, 8102, 8632, 8152, 8677, 8122
Heat Conduction Interface: Ray-8011
Products Specification 產品規格
|
品名 Item
|
組成 Composition
|
粘度 Cps
|
成型硬度 Hardness Shore
|
折射 Refractive Index N/mm2
|
透光率 Light Tramsmissivity 450nm/1mm(%)
|
成型條件 Condition
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Ray-8101
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A:B
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A:400
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-
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1.405
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85
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150℃, 30 min
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01:01
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B:600
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Ray-8102
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A:B
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A:10000
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12(A)
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1.411
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88
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150℃, 5 min
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10:01
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B:1500
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Ray-8122
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A:B
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A:10000
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35(A)
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1.411
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50
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150℃, 10 min
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10:01
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B:1500
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Ray-8632
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A:B
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A:5000
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30(A)
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1.522
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92
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150℃, 5 min
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10:01
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B:1500
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Ray-8152
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A:B
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A:2000
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60(D)
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1.413
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88
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150℃, 5 min
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10:01
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B:1500
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Ray-8677
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A:B
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A:5000
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70(D)
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1.522
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92
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150℃, 5 min
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10:01
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B:1500
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Ray-8011
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one
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-
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55(A)
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-
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-
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25℃, 5 hrs
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component
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|
Welcome for customer's own requested specification |
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