Silicone Series for LED,Solar and Electronic Encapsulation
依傳統的LED封裝結構為例，一般是用膠或銀膠將LED晶片黏貼在導線架的反射杯中或SMD基座上，再由金或鋁線焊線機完成LED元件的內外連接正負極後用環氧樹脂epoxy封裝而成。若採用傳統式的LED封裝形式其程序雖然簡單，但其熱阻高達250℃/W～300℃/W。LED將會因為散熱不良而導致晶片溫度迅速上升和環氧樹脂變質，從而造成LED元件的加速老化到失去發光功能，且因為持續的熱量累積所產生的發光效率降低並造成加速LED元件本身增溫，增溫效應形成應力造成結構不良而燒毀。
利用Silicones本身具有優良之物理及化學之特性，本公司發展了一系列光電產業封裝用之矽凝膠, 矽膠, 矽樹脂，可用於晶片LED,印刷電路板的封装(Encapsulation),黏著,絕緣,導熱,防潮及緩衝處理。改善傳統環氧樹脂epoxy封裝的先天限制
Our silicone series for encapsulation field exclusively apply in LED, IC chips, CPU & VLSI to transfer the internal heat to outside region, stain higher temperature, moisture proof and adhesive for better weather resistance.
Our silicone series is suitable for temperature (-50) to 250oC for a long time operation mad still keep their characters. It is the best material for Encapsulation purpose specially compare to the epoxy resin.
一般而言(Generally),
Encapsulating Silicone: Ray-8101, 8102, 8632, 8152, 8677, 8122
Heat Conduction Interface: Ray-8011
Products Specification 產品規格
|
品名 Item |
組成 Composition |
粘度 Cps |
成型硬度 Hardness Shore |
折射 Refractive Index N/mm2 |
透光率 Light Tramsmissivity 450nm/1mm(%) |
成型條件 Condition |
|
|
Ray-8101 |
A:B |
A:400 |
- |
1.405 |
85 |
150℃, 30 min |
|
|
01:01 |
B:600 |
||||||
|
Ray-8102 |
A:B |
A:10000 |
12(A) |
1.411 |
88 |
150℃, 5 min |
|
|
10:01 |
B:1500 |
||||||
|
Ray-8122 |
A:B |
A:10000 |
35(A) |
1.411 |
50 |
150℃, 10 min |
|
|
10:01 |
B:1500 |
||||||
|
Ray-8632 |
A:B |
A:5000 |
30(A) |
1.522 |
92 |
150℃, 5 min |
|
|
10:01 |
B:1500 |
||||||
|
Ray-8152 |
A:B |
A:2000 |
60(D) |
1.413 |
88 |
150℃, 5 min |
|
|
10:01 |
B:1500 |
||||||
|
Ray-8677 |
A:B |
A:5000 |
70(D) |
1.522 |
92 |
150℃, 5 min |
|
|
10:01 |
B:1500 |
||||||
|
Ray-8011 |
one |
- |
55(A) |
- |
- |
25℃, 5 hrs |
|
|
component |
Welcome for customer's own requested specification
依傳統的LED封裝結構為例，一般是用膠或銀膠將LED晶片黏貼在導線架的反射杯中或SMD基座上，再由金或鋁線焊線機完成LED元件的內外連接正負極後用環氧樹脂epoxy封裝而成。若採用傳統式的LED封裝形式其程序雖然簡單，但其熱阻高達250℃/W～300℃/W。LED將會因為散熱不良而導致晶片溫度迅速上升和環氧樹脂變質，從而造成LED元件的加速老化到失去發光功能，且因為持續的熱量累積所產生的發光效率降低並造成加速LED元件本身增溫，增溫效應形成應力造成結構不良而燒毀。
利用Silicones本身具有優良之物理及化學之特性，本公司發展了一系列光電產業封裝用之矽凝膠, 矽膠, 矽樹脂，可用於晶片LED,印刷電路板的封装(Encapsulation),黏著,絕緣,導熱,防潮及緩衝處理。改善傳統環氧樹脂epoxy封裝的先天限制 Our silicone series for encapsulation field exclusively apply in LED, IC chips, CPU & VLSI to transfer the internal heat to outside region, stain higher temperature, moisture proof and adhesive for better weather resistance. Our silicone series is suitable for temperature (-50) to 250oC for a long time operation mad still keep their characters. It is the best material for Encapsulation purpose specially compare to the epoxy resin.
Encapsulating Silicone: Ray-8101, 8102, 8632, 8152, 8677, 8122
Heat Conduction Interface: Ray-8011
Products Specification 產品規格
|
品名 Item |
組成 Composition |
粘度 Cps |
成型硬度 Hardness Shore |
折射 Refractive Index N/mm2 |
透光率 Light Tramsmissivity 450nm/1mm(%) |
成型條件 Condition |
|
|
Ray-8101 |
A:B |
A:400 |
- |
1.405 |
85 |
150℃, 30 min |
|
|
01:01 |
B:600 |
||||||
|
Ray-8102 |
A:B |
A:10000 |
12(A) |
1.411 |
88 |
150℃, 5 min |
|
|
10:01 |
B:1500 |
||||||
|
Ray-8122 |
A:B |
A:10000 |
35(A) |
1.411 |
50 |
150℃, 10 min |
|
|
10:01 |
B:1500 |
||||||
|
Ray-8632 |
A:B |
A:5000 |
30(A) |
1.522 |
92 |
150℃, 5 min |
|
|
10:01 |
B:1500 |
||||||
|
Ray-8152 |
A:B |
A:2000 |
60(D) |
1.413 |
88 |
150℃, 5 min |
|
|
10:01 |
B:1500 |
||||||
|
Ray-8677 |
A:B |
A:5000 |
70(D) |
1.522 |
92 |
150℃, 5 min |
|
|
10:01 |
B:1500 |
||||||
|
Ray-8011 |
one |
- |
55(A) |
- |
- |
25℃, 5 hrs |
|
|
component |
Welcome for customer's own requested specification
