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Carol Young Corporation
 
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Silicone Series for LED,Electronic and solar panel Encapsulation(1)
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  產品介紹
 

 
 
Silicone Series for LED,Solar and Electronic Encapsulation
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產品型號
RAY Series

產品介紹

 

傳統的LED封裝結構為例,一般是用膠或銀膠將LED晶片黏貼在導線架的反射杯中或SMD基座上,再由金或鋁線焊線機完成LED元件的內外連接正負極後用環氧樹脂epoxy封裝而成。若採用傳統式的LED封裝形式其程序雖然簡單,但其熱阻高達250/W300/WLED將會因為散熱不良而導致晶片溫度迅速上升和環氧樹脂變質,從而造成LED元件的加速老化到失去發光功能,且因為持續的熱量累積所產生的發光效率降低並造成加速LED元件本身增溫,增溫效應形成應力造成結構不良而燒毀。

 

利用Silicones本身具有優良之物理及化學之特性,本公司發展了一系列光電產業封裝用之矽凝膠, 矽膠, 矽樹脂,可用於晶片LED,印刷電路板的封装(Encapsulation),黏著,絕緣,導熱,防潮及緩衝處理。改善傳統環氧樹脂epoxy封裝的先天限制

                                                      

Our silicone series for encapsulation field exclusively apply in LED, IC chips, CPU & VLSI to transfer the internal heat to outside region, stain higher temperature, moisture proof and adhesive for better weather resistance.

 

Our silicone series is suitable for temperature (-50) to 250oC for a long time operation mad still keep their characters. It is the best material for Encapsulation purpose specially compare to the epoxy resin.

 

一般而言(Generally),

 

Encapsulating Silicone: Ray-8101, 8102, 8632, 8152, 8677, 8122

Heat Conduction Interface: Ray-8011

 

Products Specification 產品規格

品名                                         Item

組成                           Composition

粘度                       Cps

成型硬度      Hardness                  Shore

折射           Refractive Index           N/mm2

透光率                       Light Tramsmissivity            450nm/1mm(%)

成型條件           Condition

 
 
 

Ray-8101

A:B

A:400

-

1.405

85

150, 30 min

 

01:01

B:600

 

Ray-8102

A:B

A:10000

12(A)

1.411

88

150, 5 min

 

10:01

B:1500

 

Ray-8122

A:B

A:10000

35(A)

1.411

50

150, 10 min

 

10:01

B:1500

 

Ray-8632

A:B

A:5000

30(A)

1.522

92

150, 5 min

 

10:01

B:1500

 

Ray-8152

A:B

A:2000

60(D)

1.413

88

150, 5 min

 

10:01

B:1500

 

Ray-8677

A:B

A:5000

70(D)

1.522

92

150, 5 min

 

10:01

B:1500

 

Ray-8011

one

-

55(A)

-

-

25, 5 hrs

 

component

 

 

Welcome for customer's own requested specification


產品特色

 傳統的LED封裝結構為例,一般是用膠或銀膠將LED晶片黏貼在導線架的反射杯中或SMD基座上,再由金或鋁線焊線機完成LED元件的內外連接正負極後用環氧樹脂epoxy封裝而成。若採用傳統式的LED封裝形式其程序雖然簡單,但其熱阻高達250/W300/WLED將會因為散熱不良而導致晶片溫度迅速上升和環氧樹脂變質,從而造成LED元件的加速老化到失去發光功能,且因為持續的熱量累積所產生的發光效率降低並造成加速LED元件本身增溫,增溫效應形成應力造成結構不良而燒毀。

利用Silicones本身具有優良之物理及化學之特性,本公司發展了一系列光電產業封裝用之矽凝膠, 矽膠, 矽樹脂,可用於晶片LED,印刷電路板的封装(Encapsulation),黏著,絕緣,導熱,防潮及緩衝處理。改善傳統環氧樹脂epoxy封裝的先天限制

Our silicone series for encapsulation field exclusively apply in LED, IC chips, CPU & VLSI to transfer the internal heat to outside region, stain higher temperature, moisture proof and adhesive for better weather resistance.

Our silicone series is suitable for temperature (-50) to 250oC for a long time operation mad still keep their characters. It is the best material for Encapsulation purpose specially compare to the epoxy resin.

 


規格說明

 Encapsulating Silicone: Ray-8101, 8102, 8632, 8152, 8677, 8122

Heat Conduction Interface: Ray-8011

Products Specification 產品規格

品名                                         Item

組成                           Composition

粘度                       Cps

成型硬度      Hardness                  Shore

折射           Refractive Index           N/mm2

透光率                       Light Tramsmissivity            450nm/1mm(%)

成型條件           Condition

 
 
 

Ray-8101

A:B

A:400

-

1.405

85

150, 30 min

 

01:01

B:600

 

Ray-8102

A:B

A:10000

12(A)

1.411

88

150, 5 min

 

10:01

B:1500

 

Ray-8122

A:B

A:10000

35(A)

1.411

50

150, 10 min

 

10:01

B:1500

 

Ray-8632

A:B

A:5000

30(A)

1.522

92

150, 5 min

 

10:01

B:1500

 

Ray-8152

A:B

A:2000

60(D)

1.413

88

150, 5 min

 

10:01

B:1500

 

Ray-8677

A:B

A:5000

70(D)

1.522

92

150, 5 min

 

10:01

B:1500

 

Ray-8011

one

-

55(A)

-

-

25, 5 hrs

 

component

 

Welcome for customer's own requested specification


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